Samsung targets mass production of 1.4nm process technology by 2027

Samsung Electronics Unveils Plans for 1.4nm Process Technology and Production Capacity Investment at Samsung Foundry Forum 2022

• Samsung targets mass production of 2nm process technology by 2025 and 1.4nm by 2027
• Samsung plans to increase its production capacity for advanced nodes by more than 3 times by 2027
• Non-mobile applications, including HPC and automotive, expected to exceed 50% of its foundry portfolio by 2027
• Samsung Foundry strengthens its customer service capabilities through its partner ecosystem

Dr. Si-young Choi, President and Head of Foundry Business at Samsung Electronics, delivers his keynote speech at the Samsung Foundry Forum 2022.

Samsung Electronics, a global leader in advanced semiconductor technology, today announced an enhanced business strategy for its foundry business with the introduction of advanced technologies at its annual Samsung Foundry Forum event.

With significant market growth in high performance computing (HPC), artificial intelligence (AI), 5/6G connectivity and automotive applications, the demand for advanced semiconductors has increased dramatically, making innovation in semiconductor process technology critical to the commercial success of foundry customers. To that end, Samsung has underscored its commitment to bring its most advanced process technology, 1.4 nanometers (nm), to mass production in 2027.

During the event, Samsung also described the measures taken by its foundry business to meet customer needs, including: △ technological innovation of foundry processes, △ optimization of process technology for each application specific, △ stable production capacities and △ personalized services for customers.

“The goal of technology development up to 1.4nm and specialized foundry platforms for each application, as well as stable supply through constant investment are all part of Samsung’s strategies to ensure customer confidence. and support their success,” said Dr. Si-young Choi, President. and Head of Foundry Business at Samsung Electronics. “Making each customer’s innovations happen with our partners has been at the heart of our foundry service.”

Introducing Samsung’s 2027 Advanced Node Roadmap up to 1.4nm

With the company’s success in bringing the latest 3nm process technology to mass production, Samsung will further improve the gate-all-around (GAA)-based technology and plans to introduce the 2nm process in 2025 and the 1.4 nm process in 2027.

While being at the forefront of process technologies, Samsung is also accelerating the development of 2.5D/3D heterogeneous integration packaging technology to provide a complete system solution in foundry services.

Through continued innovation, its 3D X-Cube packaging with micro-bump interconnect will be ready for mass production in 2024, and the bumpless X-Cube will be available in 2026.

The proportion of HPC, automotive and 5G will exceed 50% by 2027

Samsung is actively planning to target high-performance, low-power semiconductor markets such as HPC, automotive, 5G and Internet of Things (IoT).

To better meet customer needs, custom and bespoke process nodes were introduced at this year’s Foundry Forum. Samsung will enhance its GAA-based 3nm process support for HPC and mobile, while further diversifying the specialized 4nm process for HPC and automotive applications.

For automotive customers in particular, Samsung currently provides embedded non-volatile memory (eNVM) solutions based on 28nm technology. To support automotive-grade reliability, the company plans to further expand process nodes by launching 14nm eNVM solutions in 2024 and adding 8nm eNVM in the future. Samsung mass-produced 8nm RF after 14nm RF, and 5nm RF is currently under development.

“Shell-First” operating strategy to meet customer needs in a timely manner

Samsung plans to more than triple its production capacity for advanced nodes by 2027 compared to this year.

Including the new factory under construction in Taylor, Texas, Samsung’s foundry manufacturing lines are currently spread across five locations: Giheung, Hwaseong and Pyeongtaek in Korea; and Austin and Taylor in the United States.

At the event, Samsung detailed its “Shell-First” strategy for capacity investment, building clean rooms first, regardless of market conditions. With clean rooms readily available, manufacturing equipment can be installed later and flexibly configured as needed, based on future demand. With the new investment strategy, Samsung will be able to better meet customer demands.

Plans to invest in a new “Shell-First” manufacturing line at Taylor, following the first line announced last year, as well as the potential expansion of Samsung’s global semiconductor production network have also been introduced.

Expand the SAFE ecosystem to empower personalized services

After the “Samsung Foundry Forum”, Samsung will organize the “SAFE Forum” (Samsung Advanced Foundry Ecosystem) on October 4th. New foundry technologies and strategies with ecosystem partners will be introduced in areas such as Electronic Design Automation (EDA), IP, Outsourced Semiconductor Assembly and Test (OSAT) , the Design Solution Partner (DSP), and the cloud.

In addition to 70 partner presentations, Samsung Design Platform team leaders will demonstrate the ability to apply Samsung processes such as Design Technology Co-Optimization for GAA and 2.5D/3DIC.

As of 2022, Samsung provides more than 4,000 IP addresses with 56 partners, and also cooperates with nine and 22 partners in design solution and EDA, respectively. It also offers cloud services with nine partners and packaging services with 10 partners.

With its ecosystem partners, Samsung provides integrated services that support solutions ranging from IC design to 2.5D/3D packages.

Through its robust SAFE ecosystem, Samsung plans to identify new fabless customers by strengthening personalized services with improved performance, fast delivery and price competitiveness, while actively attracting new customers such as hyperscalers and start-ups. -ups.

Beginning in the United States (San Jose) on October 3, the “Samsung Foundry Forum” will be held sequentially in Europe (Munich, Germany) on October 7, Japan (Tokyo) on October 18, and Korea (Seoul) on October 20, across which customized solutions for each region will be introduced. A recording of the event will be available online from the 21st for those who were unable to attend in person.